ITEM NAME:CP-2015 Suction Belt Suction Line Low residue No-cleaning Tin:0J Kw.The solder sticking on the pin can be sucked away to ensure no between the pins. The tin wire can be used to clean the pad of the BGA component. When the BGA component is implanted, the solder wire is used to clean the pad, which greatly increases the success rate of the ball.
