ITEM NAME:Sn63/Pb67 Welding Fluxes Solder Paste Flux XG-50 BGA Reballing Lead Glue A#S Product Description Description: Features: Suitable for smart phone repairing, electronic industrial BGA reballing. Fine soldering part, stable and smooth performance. High quality. Specification: Model: 6337 Viscosity: 37 Pa.S Granularity: 1 um Working Temperature: 183℃ Weight: approx. 37 g Included: 1 X Lead Paste.Suitable for smart phone repairing, electronic industrial BGA reballing. Fine soldering part, stable and smooth performance. High quality. Included:1 X Lead Paste. Working Temperature: 183℃. If item is defective after 3 months, you can still send it back to us.
