Item Name: Welding Flux Repair Tool for Mobile Phone No-Clean Solder Paste Flux Soldering. Viscosity:11 (PaS)Dimensions:93 x 33 x 23mmWorking temperature:273 ()Cleaning angle:No cleaningGranularity:50 (um)Package include:1PC solder paste + 1PC Booster + 1PC NeedleFeatures:100% Brand New and High Quality.This product is a moderately active rosin-type solder paste, which is widely used in the SMD rework process of mobile phone boardsGood immersion and high strength joints non-toxic and non-corrosiveGood insulation and smooth welding surface dont deteriorate and dont dryNotice:Please allow 1-3cm error due to manual measurement and make sure you do not mind before ordering.Please understand that colors may exist chromatic aberration as the different placement of pictures. *
