ITEM NAME:0.009mm Jump Wire Phone Repair Fly Cable Fingerprint Motherboard Soldering Description: Superfine Silver Jump Wire,phone motherboard soldering precise connection Copper wire, for PCB BGA Sodering Point, for iPhone Fingerprint Mainboard Chip Repair Diagmeter: 0.009mm, length:200m, durable and tensile for iphone motherboard fingerprint repair jumper wire / Jumper wire The wire is made of pure copper, and the surface is conductive. Insulation typeï ¼Å’head and tail end just lectric conduction,the wire is small and easy to be straightened, and the diameter is around 0.009mm to make precise connection and avoid short-circuit solder joints. No need to remove the lacquer,welding directly. Specification: Material: Copper Color: Silver Diameter: 0.009mm Length:200m Package Includes: 1 Roll 0.009mm 200M Silver Jump Wire Note: 1.Please allow 1~3 cm error due to manual measurement, thanks. 2.Due to the difference between different monitors, the picture may not reflect the actual color of the item. Please understand, thank you SKU: 0014184868034559.Superfine Silver Jump Wire,phone motherboard soldering precise connection Copper wire, for PCB BGA Sodering Point, for iPhone Fingerprint Mainboard Chip Repair. 1 Roll 0.009mm 200M Silver Jump Wire. No need to remove the lacquer,welding directly.