Features:
Suitable for BGA ball, semiconductor packaging, repair.
Computer motherboard north and south bridge, communications, graphics and other BGA apply.
Just apply a little each time.
It's currently the best on the market BGA, CSP rework help paste.
When the bumping of the BGA chip coated with flux paste and PCB pads are required coat.
Good BGA soldering flux paste and machine regardless of manual welding, the success rate is greatly increased.
Package Included:
1 x 10CC Lead Free BGA Solder Paste
Detail Pictures:
