Mechanic 3D BGA Reballing Stencil Repair Tool for iPhone X Motherboard Middle Layer A12 PCB Groove Planting Tin Template Reballing
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SKU: U2I-BG-1468639
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Description
Features:
3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented iphone X Middle Layer Motherboard for iPhone X Middle layer motherboard.
High temperature resistant synthetic stone made positioning slot.
Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.
Package included:
1 x 3D BGA Reballing Stencils
Details pictures:
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