Description:
To remove the IP-X motherboard layering, we use the 185-degree layering process, which comes from our fine analysis of IP-X solder paste. It also relies on the special heating design and precise temperature control ability of SS-T12A.
Heat only the areas where the IP-X motherboard needs to be removed to prevent improper heating.
The dual bayonet design ensures that the IP-X motherboard is stable on the stage.
High-purity copper is used as a negative film to ensure uniform and stable heat transfer and heating.
T12A-Android
T12A family adds Android motherboard heating system, more powerful
-Suitable for most Android phone motherboard heating
.-High-purity copper as the negative film, to ensure uniform and stable heat transfer and heating.
-Special heating design and precise temperature control ability make maintenance more efficient and maintenance safer
T12A-Face
Sunshine T12A adds ID heating station, which is mainly used to repair ID cable and risk-free replacement of distance sensor.
T12A-X3
We have always adhered to the design of high and low grooves, which only heats the middle column and does not heat the CPU.
Accurately locate the parts that need to be heated
1. Suitable for IP X / XS / XS MAX motherboard repair heating disassembly
, CPU and other components
2.Silicone heat insulation, high temperature resistance, reduce the temperature of the bottom contact surface.
3.High-purity copper is used as a negative film to ensure uniform heat transfer and heat stability.
T12A-N11
T12A mo bile phone repair heating station series
IP 11 series motherboard heating station
Suitable for IP 11/11 Pro /11 Pro Max
Fast and precise heating of the motherboard, double buckle reinforcement, local heating, safe and practical, easy to operate
Silicone insulation
The motherboard is accurately positioned
Easy to operation, small and portable, accurate position, efficient layering of the motherboard
High-purity copper as a film to ensure uniform heat transfer and heat
Good tool, made by SUNSHINE
From the persistence and improvement of the process
Temperature control
IC slot
Double buckle reinforcement
Rapid warming
Threaded interface
Partial heating
Silicone insulation
Package Includes:
1 x Host
1 x T12A-Android
1 x T12A-Face
1 x T12A-X3
1 x T12A-N11
Details Pictures:
