Volume : 100g
It can be used for PCB, BGA , PGA reworking, soldering and reballing of computer and phone chips.
Excellent capacity of solder stickiness.
Excellent Anti wet Capacity .
Widely used on BGA, PGA, CSP packages and flip chip operation .
Suitable for multiple PCB reflow.
No-clean and Lead free for environmental protection.
Package included :1 x Solder Flux Solder Paste
Details pictures :
