ITEM NAME:10cc PCB BGA Reballing Solder Flux Paste for Phone BGA IC Chips Repair #JT1 Product Description Description: Features: This solder paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips. It is a necessary material for repairing the mobile phone and other kind electronic's mainboard.. It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board. Help to repair the circuit boards and protect the electronic components. Product application: Applicable to sensors, wires, motors, safety pipes, connectors, metal shells, lighting, electronic components, SMT maintenance, BGA chip implantation, etc. NC-559: In order to wash-free solder paste, the residue color is very light and has a very high SIR value. It is recommended to be used for repairing and repairing spherical array solder joints such as BGA and CSP. Specifications: Material: ABS Shell Compound ingredients: ointment Type: wash-free Volume: 10cc Product weight: 20g Size: 100*33*23mm/3.94*1.3*0.91" Notes: 1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you! 2. Please allow slight measuring deviation due to manual measurement. Included: 1 XÂ Reballing Solder Flux Paste.Included: 1 X Reballing Solder Flux Paste. NC-559: In order to wash-free solder paste, the residue color is very light and has a very high SIR value. It is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue, so you are easy to clean the board.
