Features:The flux is very effective.
IC and PCB for no corrosive.
Only slightly higher than the boiling point of the melting point of the solder.
Shape is similar to the butter-like paste. High bond strength, PH value neutral, insulation resistance, welding surface smooth. For mobile phones, PC cards and other sophisticated electronic chip-level flux welding.
Package Included:
1 x 150g Yellow Paste Advance Quality Soldering Paste
Detail Pictures:
