ITEM NAME:43 In 1 IC Chip CPU NAND BGA Remover Thin For Mobile Phone Description: Phone BGA Chip Remover is common used disassembly tools for small and slightly smaller IC parts on the motherboard of the mobile phone. Ensure the safety during the repair process. Ultra-thin s will offer the best solution to pry out the chip easily without any damage. Perfect cleaning tool for glue removal on phone motherboard. 43 kinds of set which can meet most of the cleaning or repairing operation on motherboard. Specification: Material: Metal Handle Size: Approx. 14.7*1*1 cm/5.79*0.39*0.39 inch Package Includes: 1 Set BGA Chip Repair Tool SKU: ALU0032092951020301.1 Set BGA Chip Repair Tool. Handle Size: Approx. Perfect cleaning tool for glue removal on phone motherboard.
