Description :
BEST BST-223 Help Solder Paste Environmental Protection BGA FLUX Solder Paste Lead-free Soldering
Features :1. Make of 32 kinds of imported raw materials like new high-antioxidant and modified rosin, etc
2. Tin moisten fast, low smoke, less residue and high surface insulation resistance
3. Its boiling point is slightly higher than the melting point of tin, no corrosion on IC and PCB
4. Applicable to the repair of all kinds of SMD like PCB, BGA and PGA
Specification :
name: solding paste
model: BST-223
size: 17 x 96 x 35 mm
weight: 20g
Package Includes :
1 x BEST BST-223 solding paste
Details Pictures :
