Feaures:Lead-free, halogen-free, non-resistive and non-conductive.It is suitable for PCB, BGA, CSP packaging, welding and repairing of electronic products.
It has good activity and stable performance without adding halogen.
The solvent added in the product is organic acid, resin, moderate viscosity, good rheological property and good tin dipping effect.
Pacakge Included:
1 x BEST BST-559A 40g Insulation Soldering Paste Flux
Detail Pictures:
