Description: Middle-Level Layer Board Separate BGA Reballing Middle Frame for phone repair. High compatible with iPhone X(only for iPhone X), it can help you fixture the motherboard tightly. Upper Lower Layers board frame will offer best service for professional phone repair. High temp resistant and anti-static, it is a safety for phone motherboard soldering repair. Each item has been tested. Specification: Material: Plastic Size: Approx. 5*2.5 cm/1.97*0.98 inch Package Includes: 1 Piece Middle-Level Layer Board
