1. The product is made of double-layer synthe-tic stone material with high temperature res-istance, fast heat dissipation and no defor-mation.
2. Adopt new precision mold, double axis desi-gn, tight and not loose.
3. The card position adopts 3-level design, wh-ich can hold various mobile phone motherb-oards and IC directly for IC degumming and tin planting.
4. The double-layer base can rotate at multiple angles, especially suitable for use with micr-oscope.
5. Two mobile phone motherboards can be cl-amped at the same time, and the maximum can be used to clamp the main board of apple notebook.
