Features :
Syringe 10CC RL-403 High quality Solder Paste Flux, RELIFE RL-403 Soldering Paste Tin Sn63/Pb67 20-38um For Phone motherboard BGA soldering repair. Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding1.Good adhesion. Paste delicate, particles small, only 20~38 microns.
2.Excellent wettability.After opening, the surface remains moist for 36 hours. Does not affect the welding.
3.Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive
Specification :
Name: RELIFE RL-403 183℃ solder paste (syringe)
type: 400/401/402
weight: 20g/30g/40g
Alloy: Sn63/Pb37
Microns: 20-38um
Package includeds :
1 x solder paste
Details pictures :
