Features:3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented iphone X Middle Layer Motherboard for iPhone X Middle layer motherboard.
Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.
Specification:
Type: A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU
Package included:
1 x BGA Reballing Tool
Details pictures:
