ITEM NAME:Thermal Conductive Heatsink Plaster Silicone Grease Adhesive Paste(1pc) Product Description Description: CPU Thermal Conductive Heatsink Plaster Silicone Grease Adhesive Cooling Paste Compound Glue for 3D Printer Features: 1. It has good conductivity and wide service temperature range(-60~200℃), short term 300℃ high temperature. 2. The surface curing time is short, the adhesive force is strong, the storage period is long, non-toxic and solvent free. 3. It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries. 4. It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has high strength and fast adhesion effect. Specifications: Product weight: 5g Quantity: 1pc Heat conductive adhesive :white paste Thermal conductivity >0.671W/m.k Breaking strength 1.5MPA Surface vulcanization time 10MIN /25℃ Application: directly bonded solid components, LED and heat dissipation devices, etc. Use for : Chip, CPU, Memory, North bridge, South bridge, VGA card, Other heat dissipation part Operation Manual: 1. When it is used, the product is directly extruded, rubbed and glued to the surface of the adhesive, and then covered immediately after the test, so as to be tried again. 2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa. 3. Recommended coating thickness: 0.1-0.5mm, the thinner the better. 4. Before use, please clean with solvent (such as alcohol) adhesive surface, detergents should be surface to be clean before painting. Note: Please allow 1-3mm differs due to manual measurement. Due to the different display and different light, the picture may not show the actual color of the item. Thanks for your understand. Included: 1 x Heatsink Plaster.Heat conductive adhesive :white paste. Included:1 x Heatsink Plaster. Quantity: 1pc. Thermal conductivity >0.671W/m. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa.
